Webinar

Beat the Heat:

Solving Thermal & Cooling Issues in Your Designs

The rapid evolution within the electronics industry results in devices becoming smaller and more powerful than ever with an increased time to market need. These changes can cause challenges regarding thermal performances requiring faster and accurate analysis for power profiles and heat dissipation. 

Join us to learn how to avoid last minute design changes with the Celsius Thermal Solver which combines finite element analysis and computational fluid dynamics for an entire system analysis. 

What you will learn:

  • What design trends are resulting in greater need for awareness of thermal effects on your designs 
  • Common thermal design issues and how to solve them 
  • Why you should consider both static and transient thermal effects 
  • How to analyze and verify you design for thermal and cooling in the context of your enclosure / system 
  • See how Cadence is empowering electronics engineers and PCB designers to manage and prevent thermal issues early in the design process
Beat the Heat:
Solving Thermal & Cooling Issues in Your Designs
June 18th, 2020 2:00 PM - 3:00 PM EDT
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About your Presenter

C.T. Kao

C. T. Kao is currently a Product Management Director in the Custom IC & PCB Group of Cadence Design Systems.  He has been performing analysis, simulation, and product design in the fields of electronic packaging, semiconductor processing equipment, and Micro-Electro-Mechanical Systems (MEMS) for more than 20 years. While working at a MEMS start-up and a consulting company, he and the teams successfully developed various MEMS products including micro-mirror devices for portable display application and multiple MEMS sensors, from prototype to volume production with satisfactory reliability and yield.  C. T. previously also worked for National Semiconductor (acquired by Texas Instruments) in the Packaging Technology Group and for Applied Materials in designing semiconductor components and equipment for physical vapor deposition (PVD) and atomic layer deposition (ALD) processes.  C. T. received his B.S. from National Taiwan University and M.S. from the University of Texas at Austin, both in Mechanical Engineering, and his Ph.D. from Stanford University in Aeronautics and Astronautics.

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