High Density Interconnect

Addressing Complex and Dense PCB Designs

With device packages becoming smaller and smaller while the performance needs are increasing simultaneously, PCB designs have become more complex and dense than ever. The more complex a PCB becomes, the more challenges encountered resulting in a need to strategically plan ahead how you want your design to look. Join us to learn ways to overcome common challenges to optimize your next design with high density interconnect.

What you will learn:

  • What is High Density Interconnect?

  • Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.

  • Challenges to consider when implementing HDI during the electrical and manufacturing stages

  • Basic HDI Design Guidelines

High Density Interconnect
Addressing Complex and Dense PCB Designs
August 27th, 2020 2:00 PM - 3:00 PM EDT

About your Presenters

Jeff Kuester

Jeff is a Field Applications Engineer with over 40 years of experience in the Printed Circuit Board field. His focus is on OrCAD, Allegro, CIS/CIP, and CADSync. 

Sue Frederick

Sue has worked with the Cadence tools for over 25 years, both as a PCB Designer and Application Engineer. Prior to joining EMA, she worked in post-sales customer support at Cadence, focusing on the front-to-back OrCAD Allegro and PCB SI flows.  

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